The 2011 EDAPS Symposium

The IEEE Electrical Design of Advanced Packaging & Systems (EDAPS) has been the premier international symposium in Asia-Pacific region since it was launched in 2002 in Singapore. The EDAPS symposium consists of paper presentations, industry exhibitions, workshops and tutorials. The 2011 EDAPS will be held in Hangzhou of China from December 12 to 14, 2011.

The purpose of EDAPS Symposium is to enhance the technical awareness and technology collaborations in the Asia-Pacific region specifically in the electrical designs of chip, package and system levels from design concepts, technical challenges to the modeling and EDA tools. The papers of the symposium not only address the current technical issues but also bring out the challenges facing to IC design, SiP/SoP packaging, EMI/EMC, and EDA tools and most importantly to address the challenge issues in 3D IC and packaging design issues. The symposium is a major venue for creating the opportunity for the researchers and practitioners from the diverse fields to exchange information and build up the network.